ฮีทซิงค์เอ็มเบ็ดเด็ดปานกลาง

Overview

A large array of moderate pin fins are available for challenging cooling scenarios in which space is limited and heat loads are heavy
Solutions are available in two material variations, copper and a hybrid of copper and aluminum, both possess outstanding cooling properties
Copper pin fins for embedded devices are composed of multiple forged copper pin fin heat sinks that are joined via the high temperature brazing process
Hybrid pin fins are composed of multiple forged aluminum pin fins that are reflowed onto a copper plate
Both copper and aluminum/copper moderate pin fins are highly suitable for vertically-constrained applications, with available solutions as low as 0.2"
Googe is committed to the provision of custom parts in a cost effective fashion. Customizable parameters include length, width and height
Googe's heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
Solutions range footprint must be less than 2.5× 2.5

Aluminum /Copper Hybrid
Hybrid pin fins for embedded devices are composed of multiple forged aluminum pin fins that are reflowed onto a copper plate
Combining the forging and reflow processes enables Googe provide pin fins with very large footprints
Available solutions generate exceptional cooling power and outstanding heat spreading attributes for vertically constrained applications
Hybrid pin fins provide the heat spreading attributes of copper heat sinks, yet are significantly lighter

Copper:
Copper pin fins for embedded devices can be easily customized to meet application specific requirements
Solutions range footprint must be less than 2.5× 2.5
Copper pin fins for embedded devices are composed of multiple forged copper pin fin heat sinks that are joined via the high temperature brazing process
Combining the forging and brazing processes enables Googe to provide pin fins with very large footprints
Available solutions generate exceptional cooling power and outstanding heat spreading attributes for vertically constrained applications
Copper pin fins for embedded devices can be easily customized to meet applications specific requirements

Airspeed(LFM): 100-400 Material: Al, Al/Cu Footprint: Less than 2.5 x 2.5