เทปกาวยึดด้วยความดันไฟเบอร์กลาส 850 แบบ BerBergquist B108 Bond

BERGQUIST BP108 BOND-PLY TBP 850 Formerly known as BOND-PLY 100
Thermally Conductive, Fiberglass-Reinforced Pressure-Sensitive Adhesive Tape
BERGQUIST BP100  Features and Benefits
1.Thermal impedance: 0.52°C-in. 2 /W
(at 50 psi)
2.High bond strength to a variety
of surfaces
3.Double-sided, pressure sensitive
adhesive tape
4.High performance, thermally
conductive acrylic adhesive
5.Can be used instead of heat-cure
adhesive, screw mounting or
clip mounting

BOND-PLY TBP 850 Typical Applications Include:
1.Mount heat sink onto BGA graphic
processor or drive processor
2.Mount heat spreader onto power
converter PCB or onto motor control PCB