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MT polyimide is a homogeneous film possessing 3X the thermal conductivity and cut strength of standard CEN® CN. Its thermal conductivity property combines the characteristic of high temperature resistance make it ideal for use in controlling and managing heat in electronic assemblies. MT offers an excellent combination of electrical properties, thermal conductivity and mechanical toughness, meantime, it extends the storage periods of electronic components at temperatures between 0-30 as packaging material.

Applications: Insulation pads, heater circuits, power supplies (battery, solar power), ceramic board replacement

Property Parameter Table:
No. Testing Item Typical Value
1 Thickness 25μ M 38μ M 50μ M
2 Thickness Tolerance ± 3μ M ± 3μ M ± 3μ M
3 Tensile Strength MD ≥ 125Mpa ≥ 125Mpa ≥ 125Mpa
TD ≥ 110Mpa ≥ 110Mpa ≥ 110Mpa
4 Elongation MD ≥ 30% ≥ 30% ≥ 30%
TD ≥ 40% ≥ 35% ≥ 35%
5 Breakdown Voltage ≥ 4kv ≥ 5kv ≥ 5kv
6 Surface Resistivity ≥ 1.0× 1013Ω ≥ 1.0× 1013Ω ≥ 1.0× 1013Ω
7 Thermal Conductivity ≥ 0.36W/m. K ≥ 0.36W/m. K ≥ 0.36W/m. K