ตัวต้านทานพินของเทคโนโลยีฟอยล์แบบ Bulk (QPL ์ eครือ ข่าย )

Bulk Metal® Foil Technology
1445Q-14 Pin and 1446Q-16 Pin DIP Packages

FEATURES
Hermetically Sealed for maximum environmental
Protection - 100 % leak protection
Gross Leak: No bubbles
Fine Leak: < 5 x 10-7 CC/sec
(MIL-STD-220, Method 112, Test C, Procedure 111A)
Tested per MIL-PRF-83401
Ceramic Package: 94 % Alumina (Al2O3)
Lid: Gold plated Kovar
Solder: Tin/Gold
Leads: Alloy 42 (Iron Nickel) with 100 μ Inches gold plating
(MIL-STD-1276, Type G-21-A)
Gold ball wire bonding
Foil Chips V15X5
ADDITIONAL TESTING TO MIL SPEC

Group A testing to MIL-PRF-83401 imposes the following:
1. Thermal shock 100 %
5X from - 65 to + 125 ° C
2. Power conditioning 100 %
2.1 100 hours at 25 ° C, full power
2.2 Δ R and Δ Ratio calculation
3. Visual and Mechanical after the above tests (sample plan)
3.1 Conformity to physical size
3.2 Workmanship
3.3 Damage due to the above tests
4.10 % PDA or one piece whichewhichever is greater
5. Solderability (sample plan)
Group B sample testing to MIL-PRF-83401 imposes the

Following:
1. Temperature Coefficient of Resistance (sample plan)
2. Resistance to solvents (sample plan).